06/2015 - 05/2024 |
Huawei Technologies Duesseldorf GmbH, Munich
Research Center (MRC), Germany - principal engineer. 2019: Automotive Engineering Lab, HiSilicon branch: Feasibility of HiSilicon Kunpeng and Ascend IP in automotive designs. 2015-'18, Advanced Computing, Central Hardware Dept.: Concept design and evaluation of near-data processing on memory modules (DDR4/DDR5 DIMM-NDP), memory and ARMv8 subsystem design (high bandwidth [HBM, GDDR] and non-volatile memory [PCM, 3DX, Flash]) for scientific computing and data centers with focus on SoC digital design, performance engineering and competitive analysis (ARMv8 and x86). |
02/2015 - 05/2015 |
Roche Diagnostics GmbH, Diabetes
Care R&D, Mannheim, Germany - senior
systems engineer. |
04/2007 - 12/2014 |
Intel
GmbH, Germany Microprocessor
Lab, Braunschweig - senior research
scientist. |
07/2004 - 03/2007 |
Infineon
Technologies, Corporate Research
+ Communication Solutions
departments,
Munich, Germany - research engineer. |
05/2002 - 06/2004 |
University
of California at
Berkeley, CAD
group, Prof.
Kurt Keutzer - post-doc
researcher. |
02/1997 - 04/2002 |
ETH Zürich, Computer
Engineering and
Networks
Laboratory, Switzerland - research
assistant. |
02/1997 - 05/2001 |
Ph.D.
(Doctor of Technical Sciences) ETH
Zürich,
Computer Engineering
and Networks Laboratory, Switzerland. |
10/1991 - 12/1996 |
Dipl.-Ing.
degree (M.Sc.
equivalent) in Electrical Engineering, Technical
University of Hamburg-Harburg (TUHH), Germany. |